DIN IEC 47(CO)1012
Packages for semiconductor devices; dimensioning rules Dual-in-Line packages for surface mounting (SMD); identical with IEC 47(Central Office)1012
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 July 1987 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47(CO)1012
July 1, 1987
Packages for semiconductor devices; dimensioning rules Dual-in-Line packages for surface mounting (SMD); identical with IEC 47(Central Office)1012
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