scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MAX1259 Battery manager

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Voltage to any pin relative to GND . . . . . . . . . . . −0.3 V to +7.0 V Power dissipation (P_D): Case E . . . . . . . . . . . . . . . . . . . . . . . . 600 mW Case 2 . . . . . . . . . . . . . . . . . . . . . . . . 727 mW Storage temperature range . . . . . . . . . . . . . . . . −55°C to +125°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient(Θ_JA): Case E . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Case 2 . . . . . . . . . . . . . . . . . . . . . . . . 110°C/W

Supply voltage range (V_CC) . . . . . . . . . . . . . . . +4.5 V to +5.5 V Battery-fail trip point V(_BATTP) . . . . . . . . . . . . 2.0 v Input capacitance (C_IN) . . . . . . . . . . . . . . . . . 10 pF Output capacitance (C_OUT) . . . . . . . . . . . . . . . . 10 pF Ambient operating temperature range (T_A) . . . . . . . . −55°C to +125°C

intended Use: