DIN EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/620/CDV:2005); German version prEN 60191-6-13:2005
inactive
| Organization: | DIN |
| Publication Date: | 1 July 2005 |
| Status: | inactive |
| Page Count: | 26 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
June 1, 2017
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016
Dieser Teil von IEC 60191 legt einen Konstruktionsleitfaden für Open-top-Halbleiterfassungen (oben offene Fassungen) für Feinraster-Ball-Grid-Array (FBGA) und Feinraster-Land-Grid-Array (FLGA) fest....
July 1, 2013
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)
A description is not available for this item.
April 1, 2008
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007
A description is not available for this item.
DIN EN 60191-6-13
July 1, 2005
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/620/CDV:2005); German version prEN 60191-6-13:2005
A description is not available for this item.
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