DIN IEC 47D(Sec)36
Semiconductor devices, mechanical standardization - Plastic shrink small outline package (SSOP), 5,3 mm body width, 0,65 mm pitch, 1,25 mm lead length (IEC 47D(Sec)36:1994)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 February 1995 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47D(Sec)36
February 1, 1995
Semiconductor devices, mechanical standardization - Plastic shrink small outline package (SSOP), 5,3 mm body width, 0,65 mm pitch, 1,25 mm lead length (IEC 47D(Sec)36:1994)
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