DIN EN 61189-3
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997); German version EN 61189-3:1997
inactive
| Organization: | DIN |
| Publication Date: | 1 October 1997 |
| Status: | inactive |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
June 1, 2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008
A description is not available for this item.
August 1, 2000
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997 + A1:1999); German version EN 61189-3:1997 + A1:1999
A description is not available for this item.
DIN EN 61189-3
October 1, 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:1997); German version EN 61189-3:1997
A description is not available for this item.
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