DIN IEC 47D/109/CD
Semiconductor devices, mechanical standardization - Plastic Thin Shrink Small Outline Package (TSSOP/HTSSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/109/CD:1996)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 September 1996 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47D/109/CD
September 1, 1996
Semiconductor devices, mechanical standardization - Plastic Thin Shrink Small Outline Package (TSSOP/HTSSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/109/CD:1996)
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