DIN IEC 62047-2
Microelectromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 47/1759/CD:2004)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 August 2004 |
| Status: | inactive |
| Page Count: | 22 |
| ICS Code (Electromechanical components in general): | 31.220.01 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN IEC 62047-2
August 1, 2004
Microelectromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 47/1759/CD:2004)
A description is not available for this item.
References
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