UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

DIN IEC 60191-6

Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)

inactive, Most Current
Organization: DIN
Publication Date: 1 November 2007
Status: inactive
Page Count: 73
ICS Code (Electrical and electronics engineering drawings): 01.100.25
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

DIN IEC 60191-6
November 1, 2007
Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
A description is not available for this item.
Advertisement