DIN IEC 91/142/CD
Attachment materials for electronics assemblies - Part 1-2: Requirements for soldering paste fluxes for high quality; interconnections in electronics assembly (IEC 91/142/CD:1998)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 November 1998 |
| Status: | inactive |
| ICS Code (Brazing and soldering): | 25.160.50 |
Document History
DIN IEC 91/142/CD
November 1, 1998
Attachment materials for electronics assemblies - Part 1-2: Requirements for soldering paste fluxes for high quality; interconnections in electronics assembly (IEC 91/142/CD:1998)
A description is not available for this item.
References
Related Products
Searching for related products...