DIN EN IEC 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 October 2019 |
| Status: | inactive |
| Page Count: | 56 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN EN IEC 60749-20
October 1, 2019
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019
A description is not available for this item.