DIN IEC 61760-3
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering (IEC 91/777/CD:2008)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 September 2008 |
| Status: | inactive |
| Page Count: | 37 |
| ICS Code (Electronic components in general): | 31.020 |
Document History
DIN IEC 61760-3
September 1, 2008
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering (IEC 91/777/CD:2008)
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References
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