IEC 60749-15
Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices
inactive
Buy Now
| Organization: | IEC |
| Publication Date: | 1 February 2003 |
| Status: | inactive |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
July 1, 2020
Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
October 1, 2010
Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
IEC 60749-15
February 1, 2003
Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices
A description is not available for this item.