DIN IEC 91/159/CD
IEC 61192-3: Printed board assemblies - Part 3: Sectional specification: Workmanship requirements for through-hole mount soldered assemblies (IEC 91/159/CD:1998)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 May 1999 |
| Status: | inactive |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN IEC 91/159/CD
May 1, 1999
IEC 61192-3: Printed board assemblies - Part 3: Sectional specification: Workmanship requirements for through-hole mount soldered assemblies (IEC 91/159/CD:1998)
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References
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