DIN 50456-1
Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Determination of the thermo-mechanical dilatation of epoxy resin moulding compounds
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 September 1991 |
| Status: | inactive |
| ICS Code (Semiconducting materials): | 29.045 |
Document History
DIN 50456-1
September 1, 1991
Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Determination of the thermo-mechanical dilatation of epoxy resin moulding compounds
A description is not available for this item.
Related Products
Searching for related products...