DIN IEC 47D/170/CDV
Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type II (IEC 47D/170/CDV:1997)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 September 1997 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47D/170/CDV
September 1, 1997
Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type II (IEC 47D/170/CDV:1997)
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