DIN EN 60191-6
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004
inactive
| Organization: | DIN |
| Publication Date: | 1 April 2005 |
| Status: | inactive |
| Page Count: | 41 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
June 1, 2010
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
A description is not available for this item.
DIN EN 60191-6
April 1, 2005
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004
A description is not available for this item.
July 1, 2001
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/392/CDV:2000); German version prEN 60191-6:2000
A description is not available for this item.
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