DIN IEC 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solder for electronic soldering applications (IEC 91/521/CD:2005)
inactive
| Organization: | DIN |
| Publication Date: | 1 September 2005 |
| Status: | inactive |
| Page Count: | 63 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Brazing and soldering): | 25.160.50 |
Document History
November 1, 2008
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/809/CD:2008)
A description is not available for this item.
DIN IEC 61190-1-3
September 1, 2005
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solder for electronic soldering applications (IEC 91/521/CD:2005)
A description is not available for this item.
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