DIN IEC 61190-1-2
Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 September 2005 |
| Status: | inactive |
| Page Count: | 31 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Brazing and soldering): | 25.160.50 |
Document History
DIN IEC 61190-1-2
September 1, 2005
Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005)
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References
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