DIN IEC 60191-6-15
Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 March 2007 |
| Status: | inactive |
| Page Count: | 30 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 60191-6-15
March 1, 2007
Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/673/CD:2006)
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