DIN IEC 47D/114/CD
Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package P-TSOP II, 10,16 mm body family (intended for inclusion into IEC 60191-2) (IEC 47D/114/CD:1996)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 August 1996 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47D/114/CD
August 1, 1996
Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package P-TSOP II, 10,16 mm body family (intended for inclusion into IEC 60191-2) (IEC 47D/114/CD:1996)
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