DIN IEC 47D/275/CDV
Semiconductor devices, mechanical standardization - Package outline for plastic fine pitch quad flat pack (FQFP) family, S-R.QPF XXXE (Intended for inclusion into IEC 60191-2) (IEC 47D/275/CDV:1999)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 July 1999 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47D/275/CDV
July 1, 1999
Semiconductor devices, mechanical standardization - Package outline for plastic fine pitch quad flat pack (FQFP) family, S-R.QPF XXXE (Intended for inclusion into IEC 60191-2) (IEC 47D/275/CDV:1999)
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