DIN EN 60749-20
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 October 2007 |
| Status: | inactive |
| Page Count: | 45 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN EN 60749-20
October 1, 2007
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007
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