DIN IEC 52(Sec)477
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E08: PTH resistance change, thermal cycling (IEC 52(Secretariat)477:1994)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 August 1994 |
| Status: | inactive |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN IEC 52(Sec)477
August 1, 1994
IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E08: PTH resistance change, thermal cycling (IEC 52(Secretariat)477:1994)
A description is not available for this item.
References
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