DIN IEC 47D/145/CDV
Semiconductor devices, mechanical standardization - Tape ball grid array outline package (TBGA) family (IEC 47D/145/CDV:1996)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 January 1997 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN IEC 47D/145/CDV
January 1, 1997
Semiconductor devices, mechanical standardization - Tape ball grid array outline package (TBGA) family (IEC 47D/145/CDV:1996)
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