CENELEC - EN 61249-5-1
Materials for Interconnection Structures Part 5. Sectional Specification Set for Conductive Foils and Films with and without Coatings Section 1. Copper Foils (for the Manufacture of Copper- Clad Base Materials)
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 January 1996 |
| Status: | active |
| Page Count: | 25 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
EN 61249-5-1
January 1, 1996
Materials for Interconnection Structures Part 5. Sectional Specification Set for Conductive Foils and Films with and without Coatings Section 1. Copper Foils (for the Manufacture of Copper- Clad Base Materials)
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