DIN EN 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4: BGA (Ball Grid Array) package measuring method (IEC 47D/469/CDV:2001); German version prEN 60191-6-4:2001
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 May 2002 |
| Status: | inactive |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
Document History
DIN EN 60191-6-4
May 1, 2002
Mechanical standardization of semiconductor devices - Part 6-4: BGA (Ball Grid Array) package measuring method (IEC 47D/469/CDV:2001); German version prEN 60191-6-4:2001
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