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IEC 62047-10

Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials

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Organization: IEC
Publication Date: 1 July 2011
Status: active
Page Count: 26
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.

The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micromachining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.

Document History

February 1, 2012
Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials
This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen...
IEC 62047-10
July 1, 2011
Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials
This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen...

References

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