MODUK - TS 10155
Adhesive, Hot Melt No 1, for Packaging Purposes
active, Most Current
| Organization: | MODUK |
| Publication Date: | 24 November 1976 |
| Status: | active |
| Page Count: | 6 |
scope:
This specification relates to a solid adhesive which is converted by heat into a viscous tacky fluid which will fuse or weld to a substrate or other adhesive film so that a firm bond is obtained on cooling.
The material is particularly suitable for use with hand applicators for packaging purposes where the joints· are not subjected to long term stress loading and temperatures in excess of 60°C are not encountered.
The application temperature of the material is between 100 and 200°C.
Document History
TS 10155
November 24, 1976
Adhesive, Hot Melt No 1, for Packaging Purposes
This specification relates to a solid adhesive which is converted by heat into a viscous tacky fluid which will fuse or weld to a substrate or other adhesive film so that a firm bond is obtained on...