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ASTM F1893

Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices

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Organization: ASTM
Publication Date: 10 May 1998
Status: inactive
Page Count: 5
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This guide defines the detailed requirements for testing microcircuits for short pulse high dose-rate ionization-induced failure. Large flash x-ray (FXR) machines operated in the photon mode, or FXR e-beam facilities are required because of the high dose-rate levels that are necessary to cause burnout. Two modes of test are possible: (1) A survival test, and (2) A failure level test.

The values stated in International System of Units (SI) are to be regarded as standard. No other units of measurement are included in this standard.

Document History

March 1, 2018
Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices
This guide defines the detailed requirements for testing semiconductor devices for short-pulse high dose-rate ionization-induced survivability and burnout failure. The test facility shall be capable...
January 1, 2011
Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices
This guide defines the detailed requirements for testing semiconductor devices for short-pulse high dose-rate ionization-induced survivability and burnout failure. The test facility shall be capable...
May 10, 1998
Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices
1. Scope 1.1 This guide defines the detailed requirements for testing microcircuits for short pulse high dose-rate ionization-induced failure. Large flash x-ray (FXR) machines operated in the photon...
ASTM F1893
May 10, 1998
Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices
This guide defines the detailed requirements for testing microcircuits for short pulse high dose-rate ionization-induced failure. Large flash x-ray (FXR) machines operated in the photon mode, or FXR...
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