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SAE AMS2424

Plating, Nickel Low-Stressed Deposit

active, Most Current
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Organization: SAE
Publication Date: 1 April 2010
Status: active
Page Count: 9
scope:

Purpose

This specification covers the requirements for electrodeposited low-stressed nickel.

Application

This process has been used typically to provide moderate corrosion and oxidation resistance to parts that may operate in service at moderately elevated temperatures, where low tensile stress in the deposit is required to avoid marked reduction of fatigue strength, but usage is not limited to such applications.

Safety - Hazardous Materials

While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards that may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.

Document History

SAE AMS2424
April 1, 2010
Plating, Nickel Low-Stressed Deposit
Purpose This specification covers the requirements for electrodeposited low-stressed nickel. Application This process has been used typically to provide moderate corrosion and oxidation resistance...
April 1, 2010
Plating, Nickel Low-Stressed Deposit
Purpose This specification covers the requirements for electrodeposited low-stressed nickel. Application This process has been used typically to provide moderate corrosion and oxidation resistance...
June 1, 2003
Plating, Nickel Low-Stressed Deposit
Purpose: This specification covers the engineering requirements for electrodeposition of a low-stressed nickel and the properties of the deposit. Application: This process has been used typically to...
July 1, 1993
Plating, Nickel Low-Stressed Deposit
1. SCOPE: 1.1 Purpose: This specification covers the engineering requirements for electro-deposition of a low-stressed nickel and the properties of the deposit. 1.2 Application: This process has been...
July 1, 1993
Plating, Nickel Low-Stressed Deposit
A description is not available for this item.
January 1, 1984
NICKEL PLATING Low-Stressed Deposit
Purpose: This specification covers the engineering requirements for electrodeposition of a low-stressed nickel and he properties of the deposit. Application: Primarily to provide moderate corrosion...
January 15, 1977
NICKEL PLATING Low-Stressed Deposit
Purpose: This specification covers the engineering requirements for electrodeposition of a low-stressed nickel and he properties of the deposit. Application: Primarily to provide moderate corrosion...
June 30, 1964
NICKEL PLATING Low Stressed Deposit
APPLICATION: Primarily for moderate corrosion and oxidation resistance where low tensile stress in the deposit is required to avoid marked reduction of fatigue strength.
June 30, 1962
NICKEL PLATING Low Stressed Deposit
APPLICATION: Primarily for moderate corrosion and oxidation resistance where low tensile stress in the deposit is required to avoid marked reduction of fatigue strength.

References

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