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SAE AMS2433

(R) Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition

active, Most Current
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Organization: SAE
Publication Date: 1 May 2020
Status: active
Page Count: 10
scope:

Purpose

This specification covers the requirements for an electroless nickel-thallium-boron or nickel-boron, deposit on various substrates.

Application

This process has been used typically to provide a hard, ductile, wear-resistant surface for operation in service up to 1000 °F (538 °C), to provide uniform build-up on complex shapes, and to enhance solderability of surfaces, but usage is not limited to such applications. This process is not generally recommended for materials subject to over-tempering or high temperature embrittlement when exposed to the post-plating heat treatment of 675 °F (357 °C) for 90 minutes (see 3.3.1 and 3.3.1.1).

Classification

The deposits covered by this specification are classified by composition as follows:

Type 1 - Nickel-Thallium-Boron

Type 2 - Nickel-Boron

Unless otherwise specified, Type 1 shall be supplied.

Safety - Hazardous Materials

While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.

Document History

SAE AMS2433
May 1, 2020
(R) Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
Purpose This specification covers the requirements for an electroless nickel-thallium-boron or nickel-boron, deposit on various substrates. Application This process has been used typically to...
October 1, 2004
Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
Purpose: This specification covers the requirements for an electroless nickel-thallium-boron or nickel-boron deposit on various substrates.
October 1, 2004
Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
Purpose: This specification covers the requirements for an electroless nickel-thallium-boron or nickel-boron deposit on various substrates. Application: This process has been used typically to...
December 1, 1994
(R) Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
1. SCOPE: 1.1 Form: This specification covers the engineering requirements for electroless deposition of a nickel-thallium-boron or nickel-boron coating on various substrates and properties of the...

References

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