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SAE - GEIA SSB 1

(R) Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications

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Organization: SAE
Publication Date: 1 January 2020
Status: active
Page Count: 19
scope:

This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, space, extreme, or other environments.

Document History

GEIA SSB 1
January 1, 2020
(R) Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications
This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that...
August 1, 2000
Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications
This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that...
November 1, 1999
Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications
A description is not available for this item.
June 1, 1999
Guidelines for Qualifying and Monitoring Plastic Encapsulated Microcircuits and Semiconductors
A description is not available for this item.
January 1, 1999
Guidelines for Qualifying and Monitoring Plastic Encapsulated Microcircuits and Semiconductors
A description is not available for this item.

References

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