This specification sheet was developed for the use of verifying performance characteristics of multilayer (three or more conductor layers) flexible and rigid-flex printed wiring boards with or without plated holes, that will use soldering for component/part mounting. Other flex or rigid-flex printed board technology types (such as single or double sided designs) can be verified to the requirements contained in this document, however, the performance parameters and baseline verification methods of other MIL−PRF−31032 performance specifications sheets may be more appropriate.