NASA - GSFC-STD-6001
Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware
|Publication Date:||22 February 2011|
The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free ceramic column grid array solder joint interconnects to boards intended for use in space flight applications (refer to Appendix A, Technology Background). This standard does not provide application specific reliability test requirements (e.g. qualification requirements).
This standard is applicable to all uses on flight hardware of ceramic packaged electronic parts which are solder-attached to printed circuit boards with solder columns (ceramic column grid array attachments or CCGAs).