Planning and Installation Methods for the Bonding and Grounding of Telecommunication and ICT Systems and Infrastructure
|Publication Date:||7 January 2020|
This standard specifies aspects of planning and installation of bonding and grounding systems for telecommunications and information communication technology (ICT) systems and infrastructure within a customer premises (see Figure 2-1). This standard is intended to enhance the planning, specification and layout of an effective telecommunications bonding and grounding system. Additionally, this standard specifies installation requirements for components of the telecommunications bonding and grounding system, and when performed correctly, will produce neat and workmanlike results.
The purpose of this standard is to allow the designer and installer to enhance their knowledge of effective telecommunications and ICT bonding and grounding systems and to strive for installations in a neat and workmanlike manner.