CENELEC - EN IEC 62878-1
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 December 2019 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 62878 specifies the generic requirements and test methods for deviceembedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Document History
EN IEC 62878-1
December 1, 2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
This part of IEC 62878 specifies the generic requirements and test methods for deviceembedded substrates. The basic test methods for printed board substrate materials and substrates themselves are...
July 1, 2015
Device embedded substrate - Part 1-1: Generic specification - Test methods
This part of IEC 62878 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are...