BSI - 20/30394767 DC
Draft BS EN IEC 62878-2-601 Device Embedding assembly technology. Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
pending, Most Current
| Organization: | BSI |
| Publication Date: | 13 December 2019 |
| Status: | pending |
| Page Count: | 13 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
20/30394767 DC
December 13, 2019
Draft BS EN IEC 62878-2-601 Device Embedding assembly technology. Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
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