DIN EN IEC 61760-3
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering (IEC 91/1588/CD:2019); Text in German and English
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 December 2019 |
| Status: | inactive |
| Page Count: | 65 |
| ICS Code (Electronic components in general): | 31.020 |
Document History
DIN EN IEC 61760-3
December 1, 2019
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering (IEC 91/1588/CD:2019); Text in German and English
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