VDE 0468-2-69
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019
active, Most Current
| Organization: | VDE |
| Publication Date: | 1 March 2020 |
| Status: | active |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Environmental testing): | 19.040 |
Document History
VDE 0468-2-69
March 1, 2020
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019
A description is not available for this item.
June 1, 2018
Umgebungseinfluesse - Teil 2-69: Pruefungen - Pruefung Te/Tc: Pruefung der Loetbarkeit von Bauelementen der Elektronik und Leiterplatten mit der Benetzungswaage (Kraftmessung) (IEC 91/1499/CD:2018); Text Deutsch und Englisch
A description is not available for this item.
May 1, 2018
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017/COR1:2018); German version EN 60068-2-69:2017/AC:2018-03
A description is not available for this item.
January 1, 2018
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017); German version EN 60068-2-69:2017
A description is not available for this item.
November 1, 2014
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method (IEC 91/1190/CD:2014)
A description is not available for this item.