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IPC-TM-650 2.6.27

Thermal Stress, Convection Reflow Assembly Simulation

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Organization: IPC
Publication Date: 1 February 2020
Status: active
Page Count: 10
scope:

This method is intended to simulate exposure to the thermal conditions by convection reflow assembly.

Purpose

This method shall be used to replicate the thermodynamic effects by assembly on the test specimen. The use of this method is intended to simulate those effects that are the result of soldering thermal excursions.

This method shall be used for qualification testing of an applicable test specimen. The evaluation of acceptability for qualification shall be in accordance with the requirements defined in 5.3.

This method may be used for lot acceptance. The evaluation for lot acceptability should be in accordance with the requirements defined in 5.3 or as agreed upon between user and supplier (AABUS).

Document History

IPC-TM-650 2.6.27
February 1, 2020
Thermal Stress, Convection Reflow Assembly Simulation
This method is intended to simulate exposure to the thermal conditions by convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects by assembly on the...
August 1, 2017
Thermal Stress, Convection Reflow Assembly Simulation
This method shall be used to simulate exposure to the thermal conditions by convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects by assembly on the...
May 1, 2009
Thermal Stress, Convection Reflow Assembly Simulation
This method shall be used to simulate exposure to the thermal conditions of convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects of assembly on the...

References

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