Thermal Stress, Convection Reflow Assembly Simulation
|Publication Date:||1 February 2020|
This method is intended to simulate exposure to the thermal conditions by convection reflow assembly.
This method shall be used to replicate the thermodynamic effects by assembly on the test specimen. The use of this method is intended to simulate those effects that are the result of soldering thermal excursions.
This method shall be used for qualification testing of an applicable test specimen. The evaluation of acceptability for qualification shall be in accordance with the requirements defined in 5.3.
This method may be used for lot acceptance. The evaluation for lot acceptability should be in accordance with the requirements defined in 5.3 or as agreed upon between user and supplier (AABUS).