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CEI EN IEC 62878-1

Device embedding assembly technology Part 1: Generic specification for device embedded substrates

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Organization: CEI
Publication Date: 1 May 2020
Status: active
Page Count: 28
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.

The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

Document History

CEI EN IEC 62878-1
May 1, 2020
Device embedding assembly technology Part 1: Generic specification for device embedded substrates
This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are...
February 1, 2016
Device embedded substrate Part 1-1: Generic specification - Test methods
This part of IEC 62878 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are...

References

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