CEI EN IEC 62878-1
Device embedding assembly technology Part 1: Generic specification for device embedded substrates
|Publication Date:||1 May 2020|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Printed circuits and boards):||31.180|
This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.