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AENOR - UNE-EN 60249-2-19/A2

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

active, Most Current
Organization: AENOR
Publication Date: 17 October 1997
Status: active
Page Count: 10
ICS Code (Printed circuits and boards): 31.180

Document History

UNE-EN 60249-2-19/A1
October 17, 1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
A description is not available for this item.
UNE-EN 60249-2-19/A2
October 17, 1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
A description is not available for this item.
UNE-EN 60249-2-19
August 11, 1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
A description is not available for this item.
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