UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

NPFC - MIL-STD-202-219

TEST METHOD STANDARD METHOD 219, SHEAR STRESS

active, Most Current
Buy Now
Organization: NPFC
Publication Date: 24 June 2020
Status: active
Page Count: 7
scope:

Purpose.

The purpose of this test is to determine the integrity of materials and procedures used to attach surface mounted chip components to package headers or other substrates. This determination is based on a measure of force applied to the chip components, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization.

Document History

MIL-STD-202-219
June 24, 2020
TEST METHOD STANDARD METHOD 219, SHEAR STRESS
Purpose. The purpose of this test is to determine the integrity of materials and procedures used to attach surface mounted chip components to package headers or other substrates. This determination...
September 11, 2017
TEST METHOD STANDARD METHOD 219, SHEAR STRESS
Purpose. The purpose of this test is to determine the integrity of materials and procedures used to attach surface mounted chip components to package headers or other substrates. This determination...

References

Advertisement