DLA - SMD-5962-93180
MICROCIRCUIT, LINEAR, CMOS, QUAD, SPDT ANALOG SWITCH, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 18 June 1993 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-358510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 MAX333 Quad SPDT CMOS analog switch
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in-line
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
V+ to V− . . . . . . . . . . . . . . . . . . . . . . . 44 V dc VIN, VCOM, VNO or VNC . . . . . . . . . . . . . . . . V+ to V− |VNO − VNC| . . . . . . . . . . . . . . . . . . . . . 32 V dc V+ to ground . . . . . . . . . . . . . . . . . . . . . 44 V dc V− to ground . . . . . . . . . . . . . . . . . . . . . −44 V dc Current, any terminal except Vcom, VNO or VNC . . . . 30 mA Continuous current, VCOM, VNO or VNC . . . . . . . . . 20 mA Peak current, VCOM, VNO or VNC (Pulsed at 1 mS, 10% duty cycle max) . . . . . . . . 70 mA Power dissipation (PD) 2/. . . . . . . . . . . . . . . 889 mW Junction temperature (TJ) . . . . . . . . . . . . . . 150°C Storage temperature range . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 sec) . . . . . . . . . +300°C Thermal resistance: Junction-to-case (ΘJC) . . . . . . . . . . . . . . . +40°C/W Junction-to-ambient (ΘJA) . . . . . . . . . . . . . +90°C/W
Ambient operating temperature range (TA) . . . . . . . −55°C TO +125°C Supply voltage range . . . . . . . . . . . . . . . . . ±5.0 V dc TO ±15.0 V dc
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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