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AIA/NAS - NAS4122

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, EXTRUDED

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Organization: AIA/NAS
Publication Date: 28 August 2020
Status: active
Page Count: 10

Document History

NAS4122
August 28, 2020
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, EXTRUDED
A description is not available for this item.
NAS4122
January 31, 2013
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, EXTRUDED
A description is not available for this item.
NAS4122
January 1, 1996
Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
A description is not available for this item.

References

This document references:
ASME Y14.5 - Dimensioning and Tolerancing
Published by ASME on January 1, 2018
INTRODUCTION This Standard establishes symbols, rules, definitions, requirements, defaults, and recommended practices for stating and interpreting dimensioning, tolerancing, and related requirements...
This document references:
ASTM B241/B241M - Standard Specification for Aluminum and Aluminum-Alloy Seamless Pipe and Seamless Extruded Tube
Published by ASTM on February 1, 2016
This specification2 covers aluminum and aluminum–alloy seamless pipe in the alloys (Note 1) and tempers shown in Table 1 [Table 2] and seamless extruded round tube in the alloys and tempers shown in...
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