scope:

This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure, such as for component placement or for applying flux and solder used to make the electrical connection.

The soldering operations, equipment, and conditions described in this document are based on electrical/electronic circuits designed and fabricated in accordance with the specifications listed in Table 1-1.

Purpose

This standard prescribes material requirements, process requirements, and acceptability requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820 and IPC-A-610. Standards may be updated at any time, including with the addition of amendments. The use of an amendment or a newer revision is not automatically required.