DIN EN IEC 62878-2-602
Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 November 2020 |
| Status: | inactive |
| Page Count: | 20 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN IEC 62878-2-602
November 1, 2020
Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English
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