AIA/NAS - NAS4120
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
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| Organization: | AIA/NAS |
| Publication Date: | 30 October 2020 |
| Status: | active |
| Page Count: | 6 |
Document History
NAS4120
October 30, 2020
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
A description is not available for this item.
March 30, 2012
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
A description is not available for this item.
March 30, 2012
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, ENCAPSULATING TYPE, TO-5
A description is not available for this item.
January 1, 1996
Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Encapsulating Type, TO-5
A description is not available for this item.