JEDEC JEP 167
Characterization of Interfacial Adhesion in Semiconductor Packages
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| Organization: | JEDEC |
| Publication Date: | 1 November 2020 |
| Status: | active |
| Page Count: | 32 |
scope:
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
NOTE Inclusion in this directory of methods does not imply applicability to all die-package configurations.
Document History
JEDEC JEP 167
November 1, 2020
Characterization of Interfacial Adhesion in Semiconductor Packages
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
NOTE Inclusion in this...
April 1, 2013
Characterization of Interfacial Adhesion in Semiconductor Packages
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
NOTE Inclusion in this...