DIN EN IEC 61189-5-301
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles (IEC 91/1620/CD:2019); Text in German and English
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 December 2020 |
| Status: | inactive |
| Page Count: | 64 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
DIN EN IEC 61189-5-301
December 1, 2020
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles (IEC 91/1620/CD:2019); Text in German and English
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